Safe To Use:
The thermal pad ; doesn’t ; contain any metal particles, electrically insulated and not capacitive, very safe to use.
Dimension 10x10x1.0mm, the thermal pads can be cut freely to any sizes and perfect to filled contact surfaces gap.
Widely application for:
Electronic products, motherboard, motor, external pad and foot pad, electronic, appliances, high LED lighting, Car machine.
Devices, automotive electronic modules (engine scrubber) modules, high supplies.
Computer host (CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard drives), laptop and any electronic equipment needing to be filled with heat dissipation.
Package Content:
100pcs10x10x1.0mm Thermal Pad
The thermal pads fill the air gap between the heat-generating device and the heat sink or metal base.
With the characteristics of softness and elasticity, the thermal pads can cover very incomplete surfaces.
Heat can be conducted from the internal device to the metal shell or the heat sink plate.
Improve the efficiency and service life of heating electronic components.
Specifications
Item Quantity 100
- Product Spcification: Dimension: 10x10mm, thickness: 1.0mm, thermal conductivity: 1.5w/m-K, material: conduction silicone, color: blue.
- Good Heat Dissipation:Perfect To Filled Contact Surfaces Gap, effectively improve the heat transfer efficiency, improve the heat transfer between the CPU / motherboard and the heat sink, and also serve as insulation, shock and sealing Equal effect.
- In -40 ℃ -200 ℃ Range Does Not Melt, Good Stability, No Toxic, Odorless,No Corrosion,No Stimulation,No Damage To Metal Materials. It Can Be Arbitrarily Cut Size,Easy To Install, Replaces Traditional Heatsink Compound Grease Paste.
- Application:Thermal Pad used in the control board of electronic and electrical products;Pads and foot pads inside and outside the motor; Appliances, computer hosts, DVDs, VCDs, and any materials that require filling and cooling modules.
- Good Cooling, Insulation, Thermal Conductivity, Wear Resistant, Non Conductive, Antistatic,Fire Retardant, Heat Resistance, High Temperature Resistance, Compression, Buffering, Etc.